The ζ1 module
This section is mostly of interest if you are designing a
new circuit around the ζ1 module.
The dimensions are shown below. They are not in
actual size on screen.
Additional dimensional information:
The following are images of the board layout and top silkscreen with
- The ζ1 PCB is 1.5mm thick.
- The board interface pin strips have 2mm pitch.
- The USB Mini-B socket extends beyond the edge of the board
by about 2mm.
- The tallest components on the module are the tactile switches,
which reach about 4.4mm above the board surface.
- The next tallest component on the module is the USB socket,
which reach about 4mm above the board surface.
- The combined height of the Sullins pin headers and receptacles
below the module, when mated together, is about 6.4mm.
This is the amount of clearance between the bottom surface of the
ζ1 module and the main board below.
- If you need to put parts in the space between the ζ1 and
the main board, you must ensure that no parts are more than 6mm
tall. Also, even though there are no parts on the bottom side
of ζ1, there are pads and vias that should not come into
electrical contact with any parts or objects.
- Despite what appears to be two mounting holes,
they are not intended to be used with spacers/standoffs and
machine screws. It is sufficient to mount the ζ1 module
to the main board by pin/receptacle contact friction alone.
Click on an image for a larger version.
|Circuit board layout
(All layers superimposed)
The following images depict the ζ1 board's four copper layers.
|Top copper layer
(Ground plane, SMD pads and some signal traces)
|Inner copper layer 1
|Inner copper layer 2
|Bottom copper layer
(3.3V power plane)
You may also view the top silkscreen
in PDF format (57KB). It could be printed on paper in actual size (1:1).
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